Semiconductor Encapsulation Mold - メーカー・企業と製品の一覧

[Case Study on Problem Solving] Mold Edition: Lens Package Void Improvement

Introducing a manual press with a degassing unit! It has become easier to set conditions, and it is also effective for demolding.

We would like to introduce a case where our company solved the persistent issue of voids in lens package transparent resin, which could not be eliminated despite various changes in molding conditions. To address this challenge, we implemented the manual press AcrossM with a degassing unit. As a result, digital control of degassing, pressing, and transfer timing became easier, and the voids were eliminated. Furthermore, with NFT mold design that takes into account factors such as number of cavities, dummy cavities, corner radii, and draft angles, we have achieved improvements not only in voids but also in mold release. [Case Study] ■ Challenge: Voids persist ■ Solution: Eliminated with degassing unit *For more details, please refer to the external link page or feel free to contact us.

• 企業：エヌ.エフ.ティ
• 価格：Other

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